PACK EXPO Las Vegas is North America’s biggest packaging event of the year. You’ll have nearly 900,000 square feet to cover—an area larger than 15 football fields—where you’ll find:

• Packaging machinery in action, just-released technologies, materials and containers
• Solutions for 40+ vertical markets from 2,000+ suppliers
• Pavilions dedicated to containers and materials, confectionery and reusable packaging
• Free educational sessions at the Innovation Stage and Reusable Packaging Learning Center, where you can stop by at any time (no registration required)
• Networking lounges for Baking & Snack, Beverage and Confectionery industry professionals

Come and meet us at PACK EXPO Las Vegas in the Central Hall and South Hall of the Las Vegas Convention Center.

The Seminar will bring together buyers and suppliers of Corrugated packaging machinery & systems from all Europe and beyond:

• End-of-line equipments
• Sensors & detection
• Automation, conveyors
• Labeling, coding & marking
• Printing solutions, inks
• Die cutting equipments
• And of course corrugated manufactures

TAPPI CorrExpo 2017 will be held October 16-18, 2017 at the Rhode Island Convention Center and Omni Hotel, in Providence, RI, USA.

A full day dedicated to corrugated with an emphasis on « How it works ».

Targeting personnel who desire a solid working knowledge on corrugator operations, quality inspections, process troubleshooting, and improving runnability. This introductory to intermediate program will benefit all corrugated and P&P personnel both novice and experienced professionals as well as sales representative.

Course topics cover:

• Why corrugated and what are the components
• Overview of a complete corrugator, operation and machine functions
• Mechanics of the bond
• Introduction to starch, terms, usage, application and testing
• Proper temperatures for bond and board flatness
• Moisture content in paper and combined board
• Board quality inspections on the corrugator (operator checks)
• Trouble-shooting and corrections
• Glue line analysis
• How to read combined board for best bond and running conditions